Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.
Field Programmable Gate Array (FPGA)
Total Products: 22,180
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | XC6SLX75T-3FGG676C | Advanced Micro Devices | IC FPGA 348 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 348 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27×27) | 38 | ||
 | XC6SLX75T-3FGG676I | Advanced Micro Devices | IC FPGA 348 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 348 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27×27) | 380 | ||
 | XC6SLX75T-4CSG484C | Advanced Micro Devices | IC FPGA 292 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 292 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19×19) | 1,762 | ||
 | XC6SLX75T-4FGG484C | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 268 Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Qualification: N/A Total RAM Bits: 3170304 | 886 | ||
 | XC6SLX75T-4FGG676C | Advanced Micro Devices | IC FPGA 348 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 348 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27×27) | 813 | ||
 | XC6SLX75T-N3CSG484I | Advanced Micro Devices | IC FPGA 292 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14 V - 1.26 V | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 292 Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Qualification: N/A Total RAM Bits: 3170304 | 548 | ||
 | XC6SLX75T-N3FG484C | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 268 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23×23) | 516 | ||
 | XC6SLX75T-N3FG676C | Advanced Micro Devices | IC FPGA 348 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 348 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27×27) | 1,479 | ||
 | XC6SLX75T-N3FGG484C | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 268 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23×23) | 184 | ||
 | XC6SLX75T-N3FGG484I | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 268 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23×23) | 772 | ||
 | XC6SLX75T-N3FGG676I | Advanced Micro Devices | IC FPGA 348 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 348 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27×27) | 863 | ||
 | XC6SLX9-2CPG196C | Advanced Micro Devices | IC FPGA 106 I/O 196CSBGA | FPGAs | 196-CSPBGA (8x8) | 1.14 V - 1.26 V | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 106 Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Qualification: N/A Total RAM Bits: 589824 | 386 | ||
 | XC6SLX9-2CPG196I | Advanced Micro Devices | IC FPGA 106 I/O 196CSBGA | FPGAs | 196-CSPBGA (8x8) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Total RAM Bits: 589824 Number of I/O: 106 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 196-TFBGA, CSBGA Supplier Device Package: 196-CSPBGA (8×8) | 826 | ||
 | XC6SLX9-2CSG225C | Advanced Micro Devices | IC FPGA 160 I/O 225CSBGA | FPGAs | 225-CSPBGA (13x13) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Total RAM Bits: 589824 Number of I/O: 160 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13×13) | 830 | ||
 | XC6SLX9-2CSG225I | Advanced Micro Devices | IC FPGA 160 I/O 225CSBGA | FPGAs | 225-CSPBGA (13x13) | 1.14 V - 1.26 V | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 160 Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Qualification: N/A Total RAM Bits: 589824 | 249 | ||
 | XC6SLX9-2CSG324C | Advanced Micro Devices | IC FPGA 200 I/O 324CSBGA | FPGAs | 324-CSPBGA (15x15) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Total RAM Bits: 589824 Number of I/O: 200 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15×15) | 459 | ||
 | XC6SLX9-2CSG324I | Advanced Micro Devices | IC FPGA 200 I/O 324CSBGA | FPGAs | 324-CSPBGA (15x15) | 1.14 V - 1.26 V | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 200 Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Qualification: N/A Total RAM Bits: 589824 | 107 | ||
 | XC6SLX9-2FT256C | Advanced Micro Devices | IC FPGA 186 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Total RAM Bits: 589824 Number of I/O: 186 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17×17) | 24 | ||
 | XC6SLX9-2FT256I | Advanced Micro Devices | IC FPGA 186 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Total RAM Bits: 589824 Number of I/O: 186 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17×17) | 294 | ||
 | XC6SLX9-2FTG256C | Advanced Micro Devices | IC FPGA 186 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 186 Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Qualification: N/A Total RAM Bits: 589824 | 1,242 |
About Field Programmable Gate Arrays (FPGA)
A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.
FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.
Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.
Types of Field Programmable Gate Arrays We Offer
Low-Density FPGAs
Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.
High-Density FPGAs
High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.
Industrial-Grade FPGAs
Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.
Hard-to-Find and Obsolete FPGAs
Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.
How to Choose the Right Field Programmable Gate Array
Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:
Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.
I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.
Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.
Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.
Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.
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